VPG – New small-scale strain gauges designed specifically for PCB reliability testing | Heisener Electronics
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VPG – New small-scale strain gauges designed specifically for PCB reliability testing

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Post-datum: 2015-09-23
VPG Micro-Measurements is designed to meet the growing demand for accurate, stable and reliable stress analysis of PCBs. Even in harsh environments, VPG Micro-Measurements has introduced three new types of small strain gages. The C2A-06-G1350-120 rectangular rose gauge and the C2A-06-015LW-120 single-axis linear gauge are designed to detect PCB surface strain in key locations in consumer electronics. The miniaturization of consumer electronics and the consequent increase in component density have led to greater thermal stress, new requirements for withstanding repeated loads, and greater demand for impact stress life. Meeting these specifications requires an accurate understanding of strain in PCBs and on-board components. Strain gauge measurements are the fastest, most accurate, and most cost-effective way to identify strain on a PCB and can be used to develop loading fixtures and test plans to optimize the test phase. The C2A-06-G1350-120 is a stacked rose gauge with a compact 5mm diameter matrix and a three-meter three-core cable that eliminates wire bonding after bonding. The company's Advanced Sensors strain gage technology enables even smaller flat rosettes to be used for surface-mount applications in confined areas and for in-layer strain measurement. The single-axis linear C2A-06-015LW-120 comes with pre-connected cables, with an active grid length of only 0.015 inches and a total matrix of 1.4mm x 1.9mm. The company says the device is ideal for mounting on surface-mount components. "In-circuit test fixtures, as well as assembly, aging and testing, system integration, and packaging and shipping, can cause the PCB and even the entire component (especially around the BGA) to rupture," said Bob Watson, director of research and development. Development, micro measurement. "Strain measurements should be made after all design iterations of the PCB, including changes to on-board components, which may change the thermal stress load. Combining Micro-Measurements instruments and StrainSmart software, our strain gauges and accessories for PCB testing are IPC / JEDEC-9704 requirements, and can collect board and component strain data in real time. This is particularly useful when new welding materials and processes are introduced, which may have different stiffnesses and introduce different welding thermal characteristics. "