Afbeelding |
Onderdeelnummer |
Fabrikant |
Omschrijving |
package |
Voorraad |
Aantal |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
IC NETWORK TERMINATOR PDSO-20
|
package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Voorraad4.896 |
|
ISDN | 1 | - | 700µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
|
|
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 32QFN
|
package: 32-VQFN Exposed Pad |
Voorraad3.168 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
|
|
Maxim Integrated |
IC TXRX MAC/PHY 64-LQFP
|
package: 64-LQFP |
Voorraad4.544 |
|
SPI, UART | 1 | - | - | - | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
|
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
package: 144-BGA, CSPBGA |
Voorraad5.152 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
|
|
|
Maxim Integrated |
IC LIU NRZ-CMI CONV 155M 56-QFN
|
package: 56-VFQFN Exposed Pad |
Voorraad6.272 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (7x7) |
|
|
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA
|
package: 484-BGA |
Voorraad7.104 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
|
|
Maxim Integrated |
IC TXRX T1/E1/J1 QUAD 256-CSBGA
|
package: 256-LBGA, CSBGA |
Voorraad3.312 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
|
|
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
package: 32-VQFN Exposed Pad |
Voorraad6.416 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
|
|
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
package: 64-TQFP |
Voorraad281.400 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
|
|
|
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256BGA
|
package: 256-BGA |
Voorraad5.872 |
|
- | 1 | 1.71 V ~ 1.89 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
|
|
Microsemi Corporation |
IC CODEC U-LAW PCM 20SOIC
|
package: 20-SOIC (0.295", 7.50mm Width) |
Voorraad6.512 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Infineon Technologies |
IC CONTROLLER INTERFACE 388-BGA
|
package: 388-BBGA |
Voorraad7.136 |
|
HDLC, PPP, Serial, TMA | - | 3 V ~ 3.6 V | 200mA | 3W | 0°C ~ 70°C | Surface Mount | 388-BBGA | 388-BGA (35x35) |
|
|
|
Microsemi Solutions Sdn Bhd. |
MULTIRATE 11.5 GBPS QUAD RETIMER
|
package: - |
Voorraad7.984 |
|
2-Wire | 1 | 1.2V | - | - | - | Surface Mount | - | 48-QFN (5x9) |
|
|
|
Microsemi Solutions Sdn Bhd. |
PB-FREE DUAL-MEDIA OCTAL PHY
|
package: - |
Voorraad4.176 |
|
Ethernet | 1 | - | - | - | - | - | - | - |
|
|
|
Microsemi Solutions Sdn Bhd. |
X2 PCIE GEN 3 REDRIVER WITH CROS
|
package: - |
Voorraad8.676 |
|
- | 2 | 2.5V | - | - | - | Surface Mount | - | 32-QFN (5x5) |
|
|
|
Microsemi Corporation |
IC SIGNAL COND OCTAL 69-BGA
|
package: 69-FBGA |
Voorraad6.800 |
|
TTL/CMOS | 8 | 2.5V, 3.3V | - | 2.65W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
|
|
|
Microsemi Corporation |
MODULE SONET/SDH
|
package: - |
Voorraad3.584 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
package: - |
Voorraad5.568 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC CNIC CIDCW CID 20SOIC
|
package: 20-SOIC (0.295", 7.50mm Width) |
Voorraad3.776 |
|
4-Wire | 1 | 2.7V ~ 5.5V | 2.8mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Microchip Technology |
IC DGTL SWITCH 2048X2048 100MQFP
|
package: 100-BQFP |
Voorraad4.848 |
|
- | 1 | 3V ~ 3.6V | 45mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
|
|
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 28PLCC
|
package: 28-LCC (J-Lead) |
Voorraad7.504 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
|
|
|
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
package: 48-VFQFN Exposed Pad |
Voorraad2.448 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
package: 48-VFQFN Exposed Pad |
Voorraad8.988 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
|
|
|
Infineon Technologies |
TELECOM IC
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Intersil |
VOIP RINGING SLIC
|
package: - |
Request a Quote |
|
- | 1 | - | - | - | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
|
|
|
Skyworks Solutions Inc. |
LINEAR IC'S
|
package: - |
Request a Quote |
|
GCI, PCM, SPI | 1 | 3.13V ~ 3.47V | 54mA | 1.4 W | - | Surface Mount | 47-VFQFN Exposed Pad | 47-QFN/LGA (6x8) |
|
|
|
Broadcom Limited |
16XGPON/16XEPON OLT, I-TEMP
|
package: - |
Request a Quote |
|
- | - | - | - | - | -40°C ~ 85°C | - | - | - |
|
|
|
Harris Corporation |
LOW COST 5 REN RINGING SLIC FOR
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Harris Corporation |
ITU CO/PABX SLIC
|
package: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 5.5mA | 1.5 W | 0°C ~ 70°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
|
|
|
Broadcom Limited |
MAP/AP-ONLY
|
package: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
