NXP Producten

BUK9520-55A,127

NXP

MOSFET N-CH 55V 54A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 2210pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 118W (Tc)
• Rds On (Max) @ Id, Vgs: 18 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

PDTC124XS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 22k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

PDTA124EE,115

NXP

TRANS PREBIAS PNP 150MW SC75

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 22k
• Resistor - Emitter Base (R2) (Ohms): 22k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

MC33911BACR2

NXP

IC SYSTEM BASIS CHIP 32LQFP

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC17XS6400EKR2

NXP

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A
• Rds On (Typ): 17 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

PCA9901DP,118

NXP

IC LED DRIVER LINEAR 20MA 8TSSOP

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 1
• Voltage - Supply (Min): 2.7V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 20mA
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

74HC147DB,118

NXP

IC 10:4 LINE PRIORITY ENC 16SSOP

• Type: Priority Encoder
• Circuit: 1 x 10:4
• Independent Circuits: 1
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

package: 16-SSOP (0.209", 5.30mm Width)

74ABT2244DB,118

NXP

IC BUFF/DVR TRI-ST DUAL 20SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 12mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

TDF8546AJS/N1ZS

NXP

IC AMP AUDIO BTL DBSMS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -
• Supplier Device Package: 27-DBS
• Package / Case: 24-SIP, Formed Leads

package: 24-SIP, Formed Leads

SA58631TK,157

NXP

IC AMP AUDIO 3W MONO AB 8HVSON

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 3W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-HVSON (4x4)
• Package / Case: 8-VDFN Exposed Pad

package: 8-VDFN Exposed Pad

MCZ33904A5EKR2

NXP

IC SYSTEM BASIS CHIP 32-SOIC

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

P3041NSN1PNB

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

MPC850VR66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

KMPC8349EVVAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

package: 672-LBGA

P5021NSN7TMC

NXP

IC SOC 64BIT 2X1.8GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (10), 10 Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.1V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

MC9328MX21VM

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (2)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 289-LFBGA
• Supplier Device Package: -

package: 289-LFBGA

LPC2102FHN48,551

NXP

IC MCU 32BIT 16KB FLASH 48HVQFN

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 70MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: 48-VFQFN Exposed Pad

MC9S08SH32CWLR

NXP

IC MCU 8BIT 32KB FLASH 28SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

MSC8144VT1000B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

• Type: SC3400 Core
• Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
• Clock Rate: 1GHz
• Non-Volatile Memory: External
• On-Chip RAM: 10.5MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 90°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MMA6255EG

NXP

ACCELEROMETER 50G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±50g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 9.37mV/V/g
• Bandwidth: 3kHz
• Output Type: Analog Voltage
• Voltage - Supply: 3.15 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

HTSMOH5601EV,118

NXP

IC HITAG-S 256BIT MOA2 PLLMC

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 85°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: -

package: MOA4, Smart Card Module

TEF6730HW/V1,557

NXP

IC DIGITAL IF FRONT END 64HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 85.3mA, 114.7mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: 64-TQFP Exposed Pad

MC17XSF500BEK

NXP

IC SWITCH PENTA 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 18V (Max)
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A, 11A
• Rds On (Typ): 7 mOhm, 17 mOhm
• Input Type: -
• Features: Internal PWM
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-HSOP

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

MC33771BTA2AE

NXP

BCC14

• Function: Battery Cell Controller
• Battery Chemistry: Lithium-Ion
• Number of Cells: 7 ~ 14
• Fault Protection: Over/Under Voltage
• Interface: SPI
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP Exposed Pad

S912XDP512J1CAG

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

S912XET512BVAL

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

S912XEQ512F1MAGR

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

S912XDG128F2VAA

NXP

16-BIT MCU S12X CORE 128KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

TDA18220HN/C1Y

NXP

CHINA CABLE MODEM SILICON TUNER

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC33879TEK

NXP

IC SW SERIAL OCTAL 32SOIC

• Output Configuration: -
• Applications: -
• Interface: -
• Load Type: -
• Technology: -
• Rds On (Typ): 750mOhm
• Current - Output / Channel: -
• Current - Peak Output: 1.2A
• Voltage - Supply: 5.5V ~ 26.5V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 125°C
• Features: -
• Fault Protection: -
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC-EP

package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad