NXP Producten

PHB146NQ06LT,118

NXP

MOSFET N-CH 55V 75A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 5675pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 250W (Tc)
• Rds On (Max) @ Id, Vgs: 5.4 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

MRF8S9202NR3

NXP

FET RF 70V 920MHZ OM780-2

• Transistor Type: LDMOS
• Frequency: 920MHz
• Gain: 19dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.3A
• Power - Output: 58W
• Voltage - Rated: 70V
• Package / Case: OM-780-2
• Supplier Device Package: OM-780-2

package: OM-780-2

MRF9030LSR1

NXP

FET RF 68V 945MHZ NI-360S

• Transistor Type: LDMOS
• Frequency: 945MHz
• Gain: 19dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 250mA
• Power - Output: 30W
• Voltage - Rated: 68V
• Package / Case: NI-360S
• Supplier Device Package: NI-360S

package: NI-360S

AFT09MS031GNR1

NXP

FET RF 40V 870MHZ TO270-2G

• Transistor Type: LDMOS
• Frequency: 870MHz
• Gain: 17.2dB
• Voltage - Test: 13.6V
• Current Rating: -
• Noise Figure: -
• Current - Test: 500mA
• Power - Output: 31W
• Voltage - Rated: 40V
• Package / Case: TO-270-2 Gull Wing
• Supplier Device Package: TO-270-2 GULL

package: TO-270-2 Gull Wing

MC33908NAE

NXP

IC SYSTEM BASIS CAN 1.5A 48LQFP

• Applications: Power Supply, Automotive Applications
• Voltage - Input: -1 V ~ 40 V
• Number of Outputs: 6
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: 48-LQFP Exposed Pad

MC07XSF517EK

NXP

IC SWITCH 54SOIC T07D17

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A, 11A
• Rds On (Typ): 7 mOhm, 17 mOhm
• Input Type: -
• Features: Internal PWM
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOIC

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

GTL16612DGG,112

NXP

IC TXRX UNVRSL 18BIT 3ST TSSOP56

• Translator Type: Mixed Signal
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 18
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: GTL
• Output Signal: LVTTL, TTL
• Output Type: Tri-State, Non-Inverted
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

74ABT651PW,112

NXP

IC TRANSCVR 3ST 8BIT INV 24TSSOP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

SC16C750IA44,512

NXP

IC UART 64BYTE 44PLCC

• Features: -
• Number of Channels: 1, UART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 3Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

SC16C752BIBS,157

NXP

IC DUAL UART 64BYTE 32HVQFN

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

SC18IS602BIPW,112

NXP

IC BRIDGE SPI/I2C 16-TSSOP

• Protocol: I2C
• Function: Controller
• Interface: SPI
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MCIMX6V7DVN10AB

NXP

I.MX 6 32BIT MPU 1GHZ 432MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LPDDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: EPDC, LCD
• Ethernet: -
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

package: 432-TFBGA

MPXS2005VLQ80

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC908KX8CPE

NXP

IC MCU 8BIT 8KB FLASH 16DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

MCF51JM32VLK

NXP

IC MCU 32BIT 32KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

package: 80-LQFP

MK22FX512AVLH12

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 22x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MC9S08AW60CFUE

NXP

IC MCU 8BIT 60KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

LPC1114FHN33/301,5

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (7x7)

package: 32-VQFN Exposed Pad

SL3S1002FTB1,115

NXP

IC UCODE G2XM FTB1 3XSON

• Type: RFID Transponder
• Frequency: 840MHz ~ 960MHz
• Standards: ISO 15693, ISO 18000-6
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 3-XDFN
• Supplier Device Package: 3-XSON (1x1.45)

package: 3-XDFN

HTMS8201FTB/AF,115

NXP

RFID HTAG ADVANCED 3XSON

• Style: Encapsulated
• Technology: Passive
• Frequency: 100kHz ~ 150kHz
• Memory Type: Read/Write
• Writable Memory: 1.76kb (User)
• Standards: ISO 11784, ISO 11785
• Operating Temperature: -
• Size / Dimension: 3.00mm x 2.00mm x 0.85mm

package: -

TEA6811V/C03,118

NXP

IC SYNTHESIZER PLL VCO 40VSO

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Car Radios
• Current - Receiving: 35mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 4.75 V ~ 5.25 V, 8.1 V ~ 8.9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-BSOP (0.295", 7.50mm Width)
• Supplier Device Package: 40-VSOP

package: 40-BSOP (0.295", 7.50mm Width)

OM7607/BGA2715

NXP

EVAL BOARD FOR BGA2715

• Type: Amplifier
• Frequency: 0Hz ~ 4GHz
• For Use With/Related Products: BGA2715
• Supplied Contents: Board

package: -

LS1046AXN8MQA

NXP

QORIQ LAYERSCAPE 4XA72 64BIT ARM

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

S912XEP100W1MALR

NXP

16-BIT MCU S12X CORE 1MB FLASH

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

SPC5604SF2CLQ6R

NXP

32BIT 512K FLASH 48K RAM

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
• Peripherals: DMA, LCD, POR, PWM, WDT
• Number of I/O: 105
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

FS32K144HNT0CLLR

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MIMXRT1171AVM8AR

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

package: -

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FS32K148HAT0MLLR

NXP

S32K148 ARM CORTEX-M4F, 80 MHZ,

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 32x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

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LPC1764FBD100K

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit Single-Core
• Speed: 100MHz
• Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

MPF7100BVMA1ESR2

NXP

POWER MANAGEMENT IC, I.MX 8XL WI

• Applications: i.MX Processors
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

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