Xilinx Inc. Producten

XCMECH-FG676

Xilinx Inc.

FG676 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XC17S30APD8I

Xilinx Inc.

IC PROM SER 30000 I-TEMP 8-DIP

• Programmable Type: OTP
• Memory Size: 300kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XC17128ELPD8I

Xilinx Inc.

IC PROM SER I-TEMP 128K 8-DIP

• Programmable Type: OTP
• Memory Size: 128kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XCZU7CG-1FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU2EG-2SFVA625I

Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

package: 625-BFBGA, FCBGA

XCZU2EG-2SBVA484I

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

package: 484-BBGA, FCBGA

XC7Z030-1FBG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCZU9CG-2FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC6SLX25T-4CSG324C

Xilinx Inc.

IC FPGA 190 I/O 324CSBGA

• Number of LABs/CLBs: 1879
• Number of Logic Elements/Cells: 24051
• Total RAM Bits: 958464
• Number of I/O: 190
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC2V1500-5FFG896I

Xilinx Inc.

IC FPGA 528 I/O 896FCBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 528
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC5VSX35T-1FFG665CES

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 2720
• Number of Logic Elements/Cells: 34816
• Total RAM Bits: 3096576
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XQ6VSX315T-2FFG1156I

Xilinx Inc.

IC FPGA VIRTEX 6 314K 1156-BGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC4VLX60-12FFG668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 6656
• Number of Logic Elements/Cells: 59904
• Total RAM Bits: 2949120
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

package: 668-BBGA, FCBGA

XC6SLX75T-2FG484C

Xilinx Inc.

IC FPGA 268 I/O 484FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 268
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S1000-4FG676I

Xilinx Inc.

IC FPGA 391 I/O 676FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 391
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XA6SLX45-2CSG324I

Xilinx Inc.

IC FPGA 218 I/O 324CSGBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 218
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC6SLX45-N3FGG484C

Xilinx Inc.

IC FPGA 316 I/O 484FBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 316
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC6SLX25-N3FT256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

• Number of LABs/CLBs: 1879
• Number of Logic Elements/Cells: 24051
• Total RAM Bits: 958464
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S400-4FT256I

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

• Number of LABs/CLBs: 896
• Number of Logic Elements/Cells: 8064
• Total RAM Bits: 294912
• Number of I/O: 173
• Number of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC2S50-5PQ208I

Xilinx Inc.

IC FPGA 140 I/O 208QFP

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 32768
• Number of I/O: 140
• Number of Gates: 50000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XA3S100E-4VQG100I

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

• Number of LABs/CLBs: 240
• Number of Logic Elements/Cells: 2160
• Total RAM Bits: 73728
• Number of I/O: 66
• Number of Gates: 100000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XA7A100T-1CSG324Q

Xilinx Inc.

IC FPGA 285 I/O 324BGA

• Number of LABs/CLBs: 7925
• Number of Logic Elements/Cells: 101440
• Total RAM Bits: 4976640
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC95216-10PQG160C

Xilinx Inc.

IC CPLD 216MC 10NS 160QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 133
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

package: 160-BQFP

XC95288XV-10PQ208C

Xilinx Inc.

IC CPLD 288MC 10NS 208QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 2.37 V ~ 2.62 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 168
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XCR3128XL-7VQ100I

Xilinx Inc.

IC CPLD 128MC 7NS 100VQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 84
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC9572XL-7TQG100I

Xilinx Inc.

IC CPLD 72MC 7.5NS 100TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 72
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x14)

package: 100-LQFP

XC95288XL-7TQG144C

Xilinx Inc.

IC CPLD 288MC 7.5NS 144TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 117
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XCVU9P-L2FSGD2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 147780
• Number of Logic Elements/Cells: 2586150
• Total RAM Bits: 391168000
• Number of I/O: 676
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.742 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 110°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XCKU15P-3FFVA1156E

Xilinx Inc.

XCKU15P-3FFVA1156E

• Number of LABs/CLBs: 65340
• Number of Logic Elements/Cells: 1143450
• Total RAM Bits: 82329600
• Number of I/O: 516
• Number of Gates: -
• Voltage - Supply: 0.873 V ~ 0.927 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCKU13P-L2FFVE900E

Xilinx Inc.

XCKU13P-L2FFVE900E

• Number of LABs/CLBs: 42660
• Number of Logic Elements/Cells: 746550
• Total RAM Bits: 70656000
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 110°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA