FTDI - New SuperSpeed IC and development solutions boost USB3.0 portfolio (FT600Q) | Heisener Electronics
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FTDI - New SuperSpeed IC and development solutions boost USB3.0 portfolio (FT600Q)

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Post-datum: 2015-09-09
FTDI's latest USB3.0-to-FIFO solution includes ICs and development boards for projects that require ultra-high-speed data transmission. The FT600Q bridge IC can perform USB3.0 SuperSpeed ​​and USB2.0 High Speed ​​data exchange with high-performance devices (such as multi-function printers, high-speed / high-resolution video cameras, medical and industrial imaging systems, still image cameras, and high performance). -HD monitors, surveillance systems and scanners. Data acquisition systems can use these devices to utilize USB3.0 as an alternative to Ethernet for high-speed, large-volume data transmission. Designers can choose the FT600Q with a low pin count 56-pin QFN package that has a 16-bit FIFO interface, or the 76-pin QFN FT601Q with a 32-bit interface. These two devices can have up to eight endpoints, and support a simple 245 FIFO interface or multi-channel FIFO mode, with a data burst rate of up to 3.2Gbit / s. Other features include configurable GPIO, multi-voltage 1.8V / 2.5V / 3.3VI / O and 100MHz or optional 66.7MHz FIFO clock. In addition, link power management (LPM), remote wake-up signals and battery charger detection help maximize the life of mobile batteries. There are initially four development boards available, which are designed to connect to the supporting FPGA board. ANSI / VITA FMC (FPGA mezzanine card) or Altera HSMC (high-speed mezzanine card) connectors with FT600Q or FT601Q IC are available, allowing developers to select target devices and development platforms from the preferred FPGA vendors. These boards can be configured to receive power from the USB VBUS, FIFO motherboard or external DC adapter. The company said that the Windows driver for the new IC will be available immediately, and Linux and MAC support will be added soon.