ROHM has developed an insulated MOSFET with a small size and ultra-low power consumption | Heisener Electronics
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ROHM has developed an insulated MOSFET with a small size and ultra-low power consumption

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Post-datum: 2022-12-03, Rohm Semiconductor

ROHM has developed a small and efficient 20V voltage Nch MOSFET*1 "RA1C030LD", which is ideal for switching applications of wearable devices, wireless headphones and other listening devices, as well as smart phones and other thin and small devices.In recent years, with the development of small equipment towards high performance and multi-functional direction, the power required inside the equipment also shows an increasing trend. The increase of battery size leads to less and less installation space for components. In addition, there is a limit to the size of the battery. In order to make more efficient use of the limited battery power, it is necessary to reduce the power loss of electrical components.

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In response to this demand, the development of easy to miniaturize and excellent characteristics of wafer-level chip size package MOSFET has gradually become the mainstream of the industry. Taking advantage of being an IC manufacturer itself, ROHM has developed a small power MOSFET with lower power losses by flexibly applying its IC process to greatly reduce the wiring resistance that would have been increased in previous discrete device processes.

The new product incorporates ROHM's own IC process in a wafer-scale chip size package *2DSN1006-3 (1.0mm×0.6mm), which achieves miniaturization while reducing power consumption. Compared with ordinary products with the same package, the index representing the relationship between on-off loss and on-off loss (on-off resistance *3×Qgd*4) has been improved by about 20%, reaching the advanced level in the industry (comparison of packaged products below 1.0mm×0.6mm), which is very helpful to reduce the area occupied by components on the circuit board of various small equipment and further improve efficiency.

In addition, ROHM's own packaging structure is used so that the side walls are protected by insulation (common products in the same package do not have insulation protection). In small devices where space constraints necessitate a high-density installation of components, the new product helps to ensure safe operation by reducing the risk of short circuits caused by contact between components.

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