NXP Producten

PSMN004-36B,118

NXP

MOSFET N-CH 36V 75A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 36V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 97nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 6000pF @ 20V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 230W (Tc)
• Rds On (Max) @ Id, Vgs: 4 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

PMFPB6532UP,115

NXP

MOSFET P-CH 20V 3.5A SOT1118

• FET Type: P-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 20V
• Current - Continuous Drain (Id) @ 25°C: 3.5A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
• Vgs(th) (Max) @ Id: 1V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 6nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 380pF @ 10V
• Vgs (Max): ±8V
• FET Feature: Schottky Diode (Isolated)
• Power Dissipation (Max): 520mW (Ta), 8.3W (Tc)
• Rds On (Max) @ Id, Vgs: 70 mOhm @ 1A, 4.5V
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: DFN2020-6
• Package / Case: 6-UDFN Exposed Pad

package: 6-UDFN Exposed Pad

ON5224,118

NXP

MOSFET RF SOT426 D2PAK

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
• Supplier Device Package: SOT-426

package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

MRF6S9160HR3

NXP

FET RF 68V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.2A
• Power - Output: 35W
• Voltage - Rated: 68V
• Package / Case: NI-780
• Supplier Device Package: NI-780

package: NI-780

MMRF5014HR5

NXP

FET RF 125V 2.5GHZ NI360

• Transistor Type: HEMT
• Frequency: 2.5GHz
• Gain: 18dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 350mA
• Power - Output: 125W
• Voltage - Rated: 125V
• Package / Case: NI-360H-2SB
• Supplier Device Package: NI-360H-2SB

package: NI-360H-2SB

PBSS8110S,126

NXP

TRANS NPN 100V 1A TO92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 1A
• Voltage - Collector Emitter Breakdown (Max): 100V
• Vce Saturation (Max) @ Ib, Ic: 200mV @ 100mA, 1A
• Current - Collector Cutoff (Max): 100nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 250mA, 10V
• Power - Max: 830mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MCZ33937EK

NXP

IC PRE-DRIVER 3PHASE 54-SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: SPI
• Technology: NMOS
• Step Resolution: -
• Applications: Automotive
• Current - Output: -
• Voltage - Supply: 6 V ~ 58 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 135°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

MC33887PFK

NXP

IC MOTOR DRIVER PAR 36PQFN

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: Parallel
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 36-PowerQFN
• Supplier Device Package: 36-QFN-PWR (9x9)

package: 36-PowerQFN

74LVT32DB,118

NXP

IC GATE OR 4CH 2-INP 14-SSOP

• Logic Type: OR Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 20mA, 32mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SSOP
• Package / Case: 14-SSOP (0.209", 5.30mm Width)

package: 14-SSOP (0.209", 5.30mm Width)

HEF4516BP,652

NXP

IC BINARY COUNTER UP/DOWN 16DIP

• Logic Type: Binary Counter
• Direction: Up, Down
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: Asynchronous
• Timing: Synchronous
• Count Rate: 18MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

TDF8599TH/N2,518

NXP

IC AMP AUDIO PWR 85W D 36HSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 85W x 1 @ 1 Ohm; 70W x 2 @ 2 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 36-HSOP
• Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

PTN3331D,118

NXP

IC DIFF LINE DRVR HI-SPD 16SOIC

• Type: Driver
• Protocol: LVDS
• Number of Drivers/Receivers: 4/0
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

UJA1168TK/FDJ

NXP

IC SBC CAN MINI HS 14HVSON

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

package: 14-VDFN Exposed Pad

USB2SERA10CFK

NXP

IC CONTROLLER USB 24QFN

• Protocol: USB
• Function: Bridge, USB to UART
• Interface: UART
• Standards: USB 2.0
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-VQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (5x5)

package: 24-VQFN Exposed Pad

LS101MASE7EHA

NXP

IC PROCESSOR DUAL CORE

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 650MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 448-FBGA Exposed Pad
• Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)

package: 448-FBGA Exposed Pad

MCHLC908QY4PE

NXP

IC MCU 8BIT 4KB FLASH 16DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

MC68334GCEH20

NXP

IC MCU 32BIT ROMLESS 132QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: -
• Number of I/O: 47
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

package: 132-BQFP Bumpered

MC68HC908GR16MFJ

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MCF51AC128AVFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

MCHC908QT2CDWER

NXP

IC MCU 8BIT 1.5KB FLASH 8SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.209", 5.30mm Width)

MKL26Z256VMC4

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

package: 121-LFBGA

PCK12429A,118

NXP

IC CLOCK GENERATOR PECL 28PLCC

• Type: Clock Generator
• PLL: Yes
• Input: Crystal
• Output: PECL
• Number of Circuits: 1
• Ratio - Input:Output: 1:1
• Differential - Input:Output: No/Yes
• Frequency - Max: 400MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

package: 28-LCC (J-Lead)

PCKV857EV,118

NXP

IC CLK BUF DDR 190MHZ 1CIRC

• PLL: Yes
• Main Purpose: Memory, DDR, SDRAM
• Input: SSTL-2
• Output: SSTL-2
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 190MHz
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFBGA
• Supplier Device Package: 56-VFBGA (4.5x7)

package: 56-VFBGA

TDA9875AH/V2,557

NXP

IC SOUND PROC DGTL TV 64QFP

• Function: Demodulator
• Applications: Consumer Audio
• Number of Channels: 2
• Interface: I2C
• Voltage - Supply: 4.75 V ~ 5.5 V
• Operating Temperature: -20°C ~ 70°C (TA)
• Specifications: -
• Package / Case: 64-BQFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-BQFP

SL2S1512FUD,003

NXP

IC I-CODE ILT-M UNCASED WAFER

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 15693, ISO 18000-3
• Interface: -
• Voltage - Supply: 1.5 V ~ 1.7 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Wafer

package: Die

PCF7900NHN/C0K,118

NXP

IC XMITTER UHF 16QFN

• Frequency: 315MHz, 434MHz, 868MHz, 915MHz
• Applications: General Purpose
• Modulation or Protocol: UHF
• Data Rate (Max): -
• Power - Output: 6dBm
• Current - Transmitting: 7mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 16-VFQFN Exposed Pad

package: 16-VFQFN Exposed Pad

MC34PF4210A0ESR2

NXP

PF4210

• Applications: Audio, Video
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (8x8)

package: 56-VFQFN Exposed Pad

MMPF0100FBANES

NXP

POWER MANAGEMENT IC I.MX6 NO-P

• Applications: -
• Voltage - Input: -
• Number of Outputs: -
• Voltage - Output: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

FS32K144UAT0MLHT

NXP

S32K144 32-BIT MCU, ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MKL27Z128VFM4R

NXP

KINETIS L 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-UFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-UFQFN Exposed Pad