NXP Producten

PZM12NB1,115

NXP

DIODE ZENER 12V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 12V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 9V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

LD6806TD/36P,125

NXP

IC REG LINEAR 3.6V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.6V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

package: SC-74A, SOT-753

NE1619DS,118

NXP

IC TEMP MONITOR 16SSOP

• Function: Temp Monitoring System (Sensor)
• Sensor Type: Internal and External
• Sensing Temperature: 0°C ~ 125°C, External Sensor
• Accuracy: ±3°C Local(Max), ±5°C Remote(Max)
• Topology: ADC, Multiplexer, Register Bank
• Output Type: SMBus
• Output Alarm: Yes
• Output Fan: No
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 16-SSOP

package: 16-SSOP (0.154", 3.90mm Width)

MC33879EK

NXP

IC SW SERIAL OCTAL 32-SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:4
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 26.5 V
• Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
• Current - Output (Max): 600mA
• Rds On (Typ): 750 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

NX5P3001UKZ

NXP

IC LOAD SWITCH HI SIDE 12WLCSP

• Switch Type: USB Switch
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 3 V ~ 30 V
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): 3A
• Rds On (Typ): 62 mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled
• Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 12-UFBGA, WLCSP
• Supplier Device Package: 12-WLCSP (1.6x1.3)

package: 12-UFBGA, WLCSP

74AHCT373D,112

NXP

IC OCT D TRANSP LATCH 3ST 20SOIC

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 4ns
• Current - Output High, Low: 8mA, 8mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

74ABT16823ADGG,118

NXP

IC D-TYPE POS TRG DUAL 56TSSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 2
• Number of Bits per Element: 9
• Clock Frequency: 190MHz
• Max Propagation Delay @ V, Max CL: 3.2ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 1mA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)

package: 56-TFSOP (0.240", 6.10mm Width)

MCZ33290EF

NXP

IC SER LNK INTER ISO KLINE 8SOIC

• Applications: Automotive
• Interface: Serial
• Voltage - Supply: 8 V ~ 18 V
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Mounting Type: Surface Mount

package: 8-SOIC (0.154", 3.90mm Width)

TDA8024TT/C1,118

NXP

IC SMART CARD INTERFACE 28TSSOP

• Applications: -
• Interface: Analog
• Voltage - Supply: 2.7 V ~ 6.5 V
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP
• Mounting Type: Surface Mount

package: 28-TSSOP (0.173", 4.40mm Width)

PCA8575BQ,118

NXP

IC I/O EXPANDER I2C 16B 24DHVQFN

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-DHVQFN (5.5x3.5)

package: 24-VFQFN Exposed Pad

MPC8572ECPXAULD

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

package: 1023-BFBGA, FCBGA

KMPC8543EVUAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MC8641DVJ1000NE

NXP

IC MPU E600 DUAL CORE 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

P1024NXN5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

package: 561-FBGA

MCIMX233DAG4C

NXP

IC MPU I.MX23 454MHZ 128LQFP

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 454MHz
• Co-Processors/DSP: Data; DCP
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, Touchscreen
• Ethernet: -
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -10°C ~ 70°C (TA)
• Security Features: Cryptography, Hardware ID
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x14)

package: 128-LQFP

PK60FN1M0VLQ15

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 48x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MCF5373LCVM240

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 62
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

package: 196-LBGA

S9S12G128F0CLF

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC9S08QA4CFQE

NXP

IC MCU 8BIT 4KB FLASH 8QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-EP (4x4)

package: 8-VDFN Exposed Pad

MM912H634DM1AER2

NXP

IC MCU 64KB LS/HS SWITCH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (64 kB)
• Controller Series: HCS12
• RAM Size: 6K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: 48-LQFP Exposed Pad

PCF85263ATT/AJ

NXP

IC RTC CLK/CALENDAR I2C 8TSSOP

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 0.9 V ~ 5.5 V
• Voltage - Supply, Battery: 0.9 V ~ 5.5 V
• Current - Timekeeping (Max): 0.885µA @ 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

PCT2075GVJ

NXP

IC SENSOR TEMP I2C/SMBUS 6TSOP

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C/SMBus
• Voltage - Supply: 2.7 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit, Shutdown Mode
• Accuracy - Highest (Lowest): ±1°C (±2°C)
• Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

package: SC-74, SOT-457

MMA1210D

NXP

ACCELEROMETER 112.5G ANAL 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±112.5g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 20
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

SLRC61002HN,557

NXP

IC TXRX CONTACTLESS READ 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 15693, ISO 18000-3
• Interface: I2C, SPI, UART
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

TDA9898HN/V2,518

NXP

IC IF PROCESSOR MULTISTD 48HVQFN

• Function: IF Processor
• Frequency: -
• RF Type: ATV, DVB, FM
• Secondary Attributes: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: 48-VFQFN Exposed Pad

BGF844,127

NXP

POWER MODULE GSM800 EDGE SOT365C

• Frequency: 869MHz ~ 894MHz
• P1dB: -
• Gain: 30dB
• Noise Figure: -
• RF Type: GSM, EDGE
• Voltage - Supply: 30V
• Current - Supply: 245mA ~ 320mA
• Test Frequency: -
• Package / Case: SOT-365C
• Supplier Device Package: SOT-365C

package: SOT-365C

BGU8004X

NXP

IC MMIC AMP LNA WLCSP6

• Frequency: 1.559GHz ~ 1.61GHz
• P1dB: -
• Gain: 19dB
• Noise Figure: 0.6dB
• RF Type: Galileo, GLONASS, GPS
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 7.5mA
• Test Frequency: -
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (0.65x0.44)

package: 6-XFBGA, WLCSP

BGU8103UKAZ

NXP

IC MMIC AMP LNA WLCSP6

• Frequency: 1.559GHz ~ 1.61GHz
• P1dB: -
• Gain: 18.5dB
• Noise Figure: 0.8dB
• RF Type: -
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 2.5mA
• Test Frequency: -
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (0.65x0.44)

package: 6-XFBGA, WLCSP

MC33FS4502CAE

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP Exposed Pad

PCAL6534EVJ

NXP

IC GPIO EXPANDER 34B VFBGA42

• Number of I/O: 34
• Interface: I²C
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 1MHz
• Voltage - Supply: 1.65V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 42-VFBGA
• Supplier Device Package: 42-VFBGA (2.6x3)

package: 42-VFBGA