NXP Producten

PBRN123EK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 600mA
• Voltage - Collector Emitter Breakdown (Max): 40V
• Resistor - Base (R1) (Ohms): 2.2k
• Resistor - Emitter Base (R2) (Ohms): 2.2k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 280 @ 300mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 1.15V @ 8mA, 800mA
• Current - Collector Cutoff (Max): 500nA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

PZM13NB2,115

NXP

DIODE ZENER 13V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 13V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 10V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

BZX284-B20,115

NXP

DIODE ZENER 20V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 20V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 14V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

BYD77D,115

NXP

DIODE AVALANCHE 200V 850MA MELF

• Diode Type: Avalanche
• Voltage - DC Reverse (Vr) (Max): 200V
• Current - Average Rectified (Io): 850mA
• Voltage - Forward (Vf) (Max) @ If: 980mV @ 1A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 25ns
• Current - Reverse Leakage @ Vr: 1µA @ 200V
• Capacitance @ Vr, F: 50pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SOD-87
• Supplier Device Package: MELF
• Operating Temperature - Junction: -65°C ~ 175°C

package: SOD-87

PRLL4001,115

NXP

DIODE GEN PURP 50V MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50V
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 1A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10µA @ 50V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SOD-87
• Supplier Device Package: MELF
• Operating Temperature - Junction: -65°C ~ 175°C

package: SOD-87

1PS59SB16,115

NXP

DIODE ARRAY SCHOTTKY 30V SMT3

• Diode Configuration: 1 Pair Common Anode
• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 30V
• Current - Average Rectified (Io) (per Diode): 200mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 800mV @ 100mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 5ns
• Current - Reverse Leakage @ Vr: 2µA @ 25V
• Operating Temperature - Junction: 125°C (Max)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

MC68882EI40A

NXP

IC FLOAT-PT COPROC 40MHZ 68PLCC

• Type: Floating-Point Co-Processor
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

package: 68-LCC (J-Lead)

MC15XS3400CPNAR2

NXP

IC SWITCH HIGH SIDE QUAD 24-QFN

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): 6A
• Rds On (Typ): 15 mOhm
• Input Type: -
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

package: 24-PowerQFN

74HC151N,652

NXP

IC MUX 8-INPUT 16-DIP

• Type: Multiplexer
• Circuit: 1 x 8:1
• Independent Circuits: 1
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74HCT573N,652

NXP

IC LATCH OCTAL D 3STATE 20DIP

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 17ns
• Current - Output High, Low: 6mA, 6mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

package: 20-DIP (0.300", 7.62mm)

74LVT16245BEV,157

NXP

IC TRANSCVR TRI-ST 16BIT 56VFBGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFBGA
• Supplier Device Package: 56-VFBGA (4.5x7)

package: 56-VFBGA

PCA9674AN,112

NXP

IC I/O EXPANDER I2C 8B 16DIP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

PCA9500PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: No
• Features: EEPROM, POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

PTN3332DH,118

NXP

IC DIFF LINE RCVR 16TSSOP

• Type: Driver
• Protocol: LVDS
• Number of Drivers/Receivers: 4/0
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

SC16IS750IPW-T

NXP

IC UART I2C/SPI 24-TSSOP

• Protocol: RS232, RS485
• Function: Controller
• Interface: I2C, SPI, UART
• Standards: -
• Voltage - Supply: 2.5V, 3.3V
• Current - Supply: 6mA
• Operating Temperature: -40°C ~ 95°C
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

MPC8548PXAUJB

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8548CVTAQGB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8313EVRADDB

NXP

IC MPU MPC83XX 267MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 267MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

package: 516-BBGA Exposed Pad

XPC850DEVR50BUR2

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MPC8569CVJANKGB

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2, DDR3, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (8), 1 Gbps (4)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

T1042NSE7MQB

NXP

IC SOC 4CORE 1200MHZ 780FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L/4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 780-FBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

package: 780-FBGA, FCBGA

MCIMX6U5EVM10AB

NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

package: 624-LFBGA

MC908QY2AMPE

NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

MPC561MZP56

NXP

IC MCU 32BIT ROMLESS 388PBGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

package: 388-BBGA

XC56309VL100AR2

NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 24kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

package: 196-LBGA

KMZ10B,112

NXP

SENSOR LINEAR ANALOG SOT195

• Type: Linear
• Technology: Magnetoresistive
• Axis: X, Y
• Output Type: Analog Voltage
• Sensing Range: -
• Voltage - Supply: 5 V ~ 12 V
• Current - Supply (Max): -
• Current - Output (Max): -
• Resolution: -
• Bandwidth: -
• Operating Temperature: -40°C ~ 150°C (TA)
• Features: -
• Package / Case: SOT-195
• Supplier Device Package: SOT195

package: SOT-195

PCF7953XTTC1AC2000

NXP

IC KEYLESS ENTRY/GO 28TSSOP

• Frequency: -
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -

package: -

BGW211EG,515

NXP

IC RF TXRX WIFI 68-LFLGA

• Type: TxRx Only
• RF Family/Standard: WiFi
• Protocol: 802.11g
• Modulation: CCK, DBPSK, DQPSK
• Frequency: 2.4GHz
• Data Rate (Max): 54Mbps
• Power - Output: 15dBm
• Sensitivity: -73dBm
• Memory Size: -
• Serial Interfaces: -
• GPIO: -
• Voltage - Supply: -
• Current - Receiving: -
• Current - Transmitting: -
• Operating Temperature: -
• Package / Case: 68-LFLGA Exposed Pad

package: 68-LFLGA Exposed Pad

OM7619/BGA2003

NXP

EVAL BOARD FOR BGA2003

• Type: Amplifier
• Frequency: 1.8GHz
• For Use With/Related Products: BGA2003
• Supplied Contents: Board

package: -

S9S08AW48E5MPUER

NXP

8-BIT MCU S08 CORE 48KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP