NXP Producten

PMN28UN,165

NXP

MOSFET N-CH 12V 5.7A 6TSOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 12V
• Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
• Vgs(th) (Max) @ Id: 700mV @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 10.1nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 740pF @ 10V
• Vgs (Max): ±8V
• FET Feature: -
• Power Dissipation (Max): 1.75W (Tc)
• Rds On (Max) @ Id, Vgs: 34 mOhm @ 2A, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-TSOP
• Package / Case: SC-74, SOT-457

package: SC-74, SOT-457

MRFE6S9200HSR5

NXP

FET RF 66V 880MHZ NI-880S

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 58W
• Voltage - Rated: 66V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

package: NI-880S

MRF7S19080HSR3

NXP

FET RF 65V 1.99GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.99GHz
• Gain: 18dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 750mA
• Power - Output: 24W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

package: NI-780S

MRF19125R5

NXP

FET RF 65V 1.93GHZ NI-880

• Transistor Type: LDMOS
• Frequency: 1.93GHz
• Gain: 13.5dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.3A
• Power - Output: 24W
• Voltage - Rated: 65V
• Package / Case: NI-880
• Supplier Device Package: NI-880

package: NI-880

BUK762R9-40E/GFJ

NXP

MOSFET N-CH D2PAK

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

BUK204-50Y,118

NXP

IC TOPFET HIGH SIDE SW D2PAK

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 5 V ~ 40 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 3.5A
• Rds On (Typ): 77 mOhm
• Input Type: Non-Inverting
• Features: Status Flag
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage, UVLO
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
• Supplier Device Package: SOT-426

package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

MC33880PEGR2

NXP

IC SRL SWITCH OCT W/SPI 28SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:8
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 24.5 V
• Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
• Current - Output (Max): 800mA
• Rds On (Typ): 550 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

GTL2002DC,125

NXP

IC XLATR 2BIT BI-DIREC OD 8VSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1V ~ 5.5V
• Voltage - VCCB: 1V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-VFSOP (0.091", 2.30mm Width)
• Supplier Device Package: 8-VSSOP, US8

package: 8-VFSOP (0.091", 2.30mm Width)

74ALVT16374DL,112

NXP

IC D-TYPE POS TRG DUAL 48SSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 2
• Number of Bits per Element: 2
• Clock Frequency: 250MHz
• Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Current - Quiescent (Iq): 100µA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-BSSOP (0.295", 7.50mm Width)

package: 48-BSSOP (0.295", 7.50mm Width)

N74F543DB,112

NXP

IC TRANSCVR TRI-ST 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

KMC68EN360ZQ25VL

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

KMPC8547EVUAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MC7457RX867NC

NXP

IC MPU MPC74XX 867MHZ 483FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 867MHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 483-BCBGA, FCCBGA
• Supplier Device Package: 483-FCCBGA (29x29)

package: 483-BCBGA, FCCBGA

MPC8347CVRAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

PK50N512CMD100

NXP

IC MCU 32BIT 512KB FLASH 144BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 25x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

package: 144-LBGA

S9S08DN16F1MLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC56F8157VVFE

NXP

IC MCU 16BIT 256KB FLASH 160BGA

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 76
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 160-BGA
• Supplier Device Package: 160-MAPBGA (15x15)

package: 160-BGA

MC9S08DZ128MLL

NXP

IC MCU 8BIT 128KB FLASH 100LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 87
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MCF51AC256ACFUE

NXP

IC MCU 32BIT 256KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

LPC4330FET180Y

NXP

IC MCU 32BIT ROMLESS 180TFBGA

• Core Processor: ARM? Cortex?-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 204MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 118
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 264K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

package: 180-TFBGA

MC9S12DP512CPVER

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MPVZ4006G7U

NXP

PRESSURE SENSOR SS CAP 8-DIP

• Pressure Type: Vented Gauge
• Operating Pressure: 0.87 PSI (6 kPa)
• Output Type: Analog Voltage
• Output: 0.3 V ~ 4.6 V
• Accuracy: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 10.88 PSI (75 kPa)
• Operating Temperature: 10°C ~ 60°C
• Package / Case: 8-DIP Module
• Supplier Device Package: 8-DIP

package: 8-DIP Module

PN5321A3HN/C106;55

NXP

IC NFC NEAR FIELD CTLR 40HVQFN

• Type: RFID Reader/Transponder
• Frequency: 13.56MHz
• Standards: FeliCa, ISO 14443, MIFARE, NFC
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

package: 40-VFQFN Exposed Pad

HTRC11001T/02EE,11

NXP

IC RFID HITAG READER 14-SOIC

• Type: RFID Reader
• Frequency: 125kHz
• Standards: -
• Interface: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

OM23221ARD

NXP

EVAL BOARD FOR NT3H2111 NT3H2211

• Type: Near Field Communication
• Frequency: 13.56MHz
• For Use With/Related Products: NT3H2111, NT3H2211
• Supplied Contents: Board

package: -

MC34PF1550A7EP

NXP

PF1550

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

package: 40-VFQFN Exposed Pad

MCIMX6G1CVM05ABR

NXP

I.MX 32-BIT MPU ARM CORTEX-A7 C

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: LVDS
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

package: 289-LFBGA

MCIMX6QP5EYM1AB

NXP

IC MPU I.MX6QP ENHAN 624FCBGA

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-LFBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

package: 624-LFBGA, FCBGA

SPC5746BBK1AMKU2

NXP

32 BIT SINGLE CORE 3M FLASH 3

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: 129
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

package: 176-LQFP Exposed Pad

S9S12VR32F0CLCR

NXP

MAGNIV 16-BIT MCU S12 CORE 32K

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP