NXP Producten

PSMN035-100LS,115

NXP

MOSFET N-CH QFN3333

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 100V
• Current - Continuous Drain (Id) @ 25°C: 27A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 23nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 1350pF @ 50V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 65W (Tc)
• Rds On (Max) @ Id, Vgs: 32 mOhm @ 10A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-DFN3333 (3.3x3.3)
• Package / Case: 8-VDFN Exposed Pad

package: 8-VDFN Exposed Pad

PDTA115TS,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 100k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

PDTC143ZE,115

NXP

TRANS PREBIAS NPN 150MW SC75

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 4.7k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

BA591,135

NXP

DIODE BAND-SWITCHING 35V SOD323

• Diode Type: Standard - Single
• Voltage - Peak Reverse (Max): 35V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
• Resistance @ If, F: 500 mOhm @ 10mA, 100MHz
• Power Dissipation (Max): 500mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-76, SOD-323
• Supplier Device Package: SOD-323

package: SC-76, SOD-323

BUK101-50GS,127

NXP

MOSFET N-CH 50V 29A TO220AB

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 29A
• Rds On (Typ): 35 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-220-3
• Supplier Device Package: TO-220AB

package: TO-220-3

74AVCH20T245DGV:11

NXP

TXRX 20BIT TRANSLATNG 56TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 2
• Channels per Circuit: 10
• Voltage - VCCA: 0.8V ~ 3.6V
• Voltage - VCCB: 0.8V ~ 3.6V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 380Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.173", 4.40mm Width)

74LVT646DB,112

NXP

IC TRANSCVR 8BIT N-INV 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

NCX2222GFX

NXP

IC COMPARATOR 8XSON

• Type: General Purpose
• Number of Elements: 2
• Output Type: Open Drain
• Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
• Voltage - Input Offset (Max): 30mV @ 5.5V
• Current - Input Bias (Max): 1pA
• Current - Output (Typ): 68mA
• Current - Quiescent (Max): 5µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 0.8µs
• Hysteresis: 9mV
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-XFDFN
• Mounting Type: Surface Mount
• Supplier Device Package: 8-XSON, SOT1089 (1.35x1)

package: 8-XFDFN

NE5232D/01,112

NXP

IC OPAMP GP 2.5MHZ RRO 8SO

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.8 V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 90nA
• Voltage - Input Offset: 200µV
• Current - Supply: 1.4mA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

PCA9509DP,118

NXP

IC REDRIVER I2C 1CH 8TSSOP

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 2pF
• Voltage - Supply: 3 V ~ 5.5 V
• Current - Supply: 3mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MPC8377ECVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC 3.0
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MC8640DVU1000HC

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

KMC7448VU1400NC

NXP

IC MPU MPC74XX 1.4GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

package: 360-CBGA, FCCBGA

MPC860PZQ80D4R2

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

BSC9132NXE7KNKB

NXP

IC MPU Q OR IQ 1.333GHZ 780FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator
• Package / Case: 780-BFBGA, FCBGA
• Supplier Device Package: 780-FCBGA (23x23)

package: 780-BFBGA, FCBGA

MC68HC908JB8FB

NXP

IC MCU 8BIT 8KB FLASH 44QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: USB
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

package: 44-QFP

MC9S12C128CPBE

NXP

IC MCU 16BIT 128KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

package: 52-LQFP

MC9S08PA32AVQH

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

LPC1114FBD48/301:1

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 42
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MK21DX128AVLK5

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 20x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

MC9S12DG128CFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

MM908E626AVDWB

NXP

IC STEPPER MOTOR DRIVER 54-SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

USB-KW24D512

NXP

BOARD DEV EVAL MKW24D512 SIP

• Type: Transceiver; 802.15.4
• Frequency: 2.4GHz
• For Use With/Related Products: KW2x
• Supplied Contents: Board

package: -

BGA3131J

NXP

IC MMIC AMP 20HVQFN

• Frequency: -
• P1dB: -
• Gain: -
• Noise Figure: -
• RF Type: -
• Voltage - Supply: -
• Current - Supply: -
• Test Frequency: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC33FS6503CAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP Exposed Pad

MC33PT2000AF

NXP

PROGRAMMABLE SOLENOID CONTROLLER

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

SPC5646CCF0VLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d, e200z0h
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/120MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 177
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 33x10b, 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-TQFP (28x28)

package: 208-LQFP

S912XET512J3VAG

NXP

16BIT512K FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

SPC5605BK0MLQ4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC34PF8100A0EP

NXP

IC POWER MANAGEMENT

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: 56-VFQFN Exposed Pad